Interfacial shear and peeling stresses in a two-plate structure subjected to monotanically increasing thermal loading

An approximate analytical model is developed for the evaluation of the interfacial shear and peeling stresses in a bi-material element composed of two elastic plates bonded together by an interface zero thickness material and subjected to monotonically increasing thermal loading. Thermal peeling stress is caused by thermal and elastic mismatch of a two-plate structure undergo a temperature change. The ``peeling'' stress can be determined from the evaluated interfacial shear stress and is proportional to deflections of the thinner plate of the structure, i.e. to its displacements with respect to the thicker plate. The interface is assumed to exhibit brittle failure at the critical shear stress value. The analytical solution qualitatively shows delamination and ultimate failure. The results are illustrated in figures and discussed.